Ats2010digg's News

Low Profile Heat Sink Cools ASICs in Tight Packaging Systems
http://www.qats.com/ — April 16, 2010: The ATS-56002 maxiFLOW heat sink features a low profile, fin array that maximizes surface area for more effective convection (air) cooling without the need for an integral fan. The 56002 heat sink is just 4 mm high; its length and width are both 25 mm. The heat sink’s thermal resistance is just 5.2°C/W at 200 ft/min airflow in ducted conditions
0 Comments     Bury     ats2010digg     94 weeks ago

ATS Heat Sink Clip System Improves Thermal Performance
http://qats.com — Advanced Thermal Solutions (ATS) has introduced superGRIP™, a two-component, attachment system that securely mounts heat sinks to a wide range of hot running BGA components. The system uses a minimal amount of space on the PCB and eliminates the need to drill holes
0 Comments     Bury     ats2010digg     95 weeks ago

QoolPCB - Fixed Price for All Heat Sinks on any PCB
http://www.qats.com — The QoolPCB™ Fixed Cost Board Cooling Program from ATS offers a single, fixed price for the complete set of heat sinks required to cool any PCB. The program includes all design engineering, hardware, testing, procurement and delivery costs for the heat sinks, thermal interface materials, attachment devices and all other parts required for the effective thermal management of a board’s component
0 Comments     Bury     ats2010digg     98 weeks ago