Technology

Low Profile Heat Sink Cools ASICs in Tight Packaging Systems
April 16, 2010: The ATS-56002 maxiFLOW heat sink features a low profile, fin array that maximizes surface area for more effective convection (air) cooling without the need for an integral fan. The 56002 heat sink is just 4 mm high; its length and width are both 25 mm. The heat sink’s thermal resistance is just 5.2°C/W at 200 ft/min airflow in ducted conditions   Archived in ASIC, ASICs, electronics cooling, heat sink, HS, sinks, maxiFLOW, heatsinks, ATS, Aavid, Digikey, digi-key, Farnell, Thermal, electronics-cooling, cooling
Bury     ats2010digg     Made news on April 16, 2010